Automatic Solder Paste Printer revolutionizes PCB assembly with ±15µm accuracy, handling ultra-fine-pitch components (01005, 0.2mm BGAs) at speeds up to 1,200 boards/hour. Vision-guided alignment, auto-stencil cleaning, and 3D SPI integration ensure defect-free paste deposition, reducing rework by 95%. Self-adjusting squeegee pressure and closed-loop control adapt to stencil wear, maintaining IPC-7525 compliance. Compatible with lead-free, no-clean, and halogen-free pastes, it supports mixed production via recipe memory. Energy-efficient and IoT-ready, it slashes material waste and downtime, ideal for automotive, 5G, and consumer electronics. Elevate your mass production with zero-defect starts and ROI-driven automation—where precision meets scalability.
This printer delivers ±15µm accuracy at speeds exceeding 1,200 boards/hour, ideal for high-volume SMT lines. Vision systems with 25µm alignment precision handle 01005 components and 0.3mm-pitch BGAs flawlessly. Auto-stencil cleaning, squeegee pressure control, and 3D SPI integration eliminate bridging, skips, or volume deviations, slashing defects by 90%. IoT-enabled predictive maintenance minimizes downtime, while recipe storage supports rapid product changeovers. Compliant with IPC-7525, it ensures consistent solder deposits for automotive, 5G, and AI hardware. By automating precision, it transforms PCB assembly into a seamless, zero-defect process—where speed and reliability drive competitive manufacturing excellence.
An automatic solder paste printer ensures 24/7 precision at speeds over 1,500 boards/hour, critical for high-volume SMT lines. Vision systems (±15µm alignment) and auto-stencil cleaning eliminate defects in 0.2mm-pitch BGAs or 01005 components, reducing rework by 95%. Closed-loop pressure control adapts to stencil wear, maintaining IPC-7525 compliance. IoT integration enables predictive maintenance, minimizing downtime, while multi-recipe storage supports rapid changeovers for mixed production. By automating paste deposition, it slashes labor costs and material waste, achieving 99.9% first-pass yield. Ideal for automotive, 5G, and consumer electronics, it transforms high-volume PCB assembly into a seamless, scalable, and cost-competitive process—where speed and zero-defect outcomes define manufacturing success.
Call us on: 
Email Us: 
Building 2, Xingye 1st Road, Fenghuang Community, Fuyong Street, Bao 'an District, Shenzhen, Guangdong, China. 
