X-Ray Inspection Machine

How an X-Ray Inspection Machine Detects Hidden Soldering Issues

This machine uses micro-focus X-rays and AI-powered 3D tomography to reveal hidden defects like BGA voids, cold joints, or cracked solder beneath components. With<2µm resolution, it inspects multi-layer PCBs, QFN leads, and µBGA arrays non-destructively. Automated algorithms classify flaws per IPC-610, while real-time analytics optimize reflow profiles to prevent recurrence. Ideal for automotive LiDAR, 5G modules, and medical implants, it slashes field failures by 85% and rework costs by 60%. By exposing subsurface flaws invisible to AOI/SPI, it ensures reliability in mission-critical electronics—where hidden defects risk catastrophic failures.

X-Ray Inspection Machine: Non-Destructive Testing for PCB Defects

This machine employs non-destructive X-ray imaging to detect hidden PCB flaws like BGA voids, solder cracks, and microvia misalignment with<1µm resolution. Advanced 3D CT scanning and AI analysis reveal defects in multi-layer boards or under shielding components, ensuring IPC-610 and MIL-STD-883 compliance. Real-time analytics optimize production processes, reducing field failures by 90% in automotive ADAS, aerospace systems, and EV battery modules. Compact, IoT-ready designs integrate seamlessly into high-speed lines, while automated reporting ensures traceability. By uncovering subsurface defects without damaging boards, it safeguards reliability in mission-critical electronics—where hidden flaws mean catastrophic risks.