F Series Lead Free Hot Air Reflow Oven

F Series Lead Free Hot Air Reflow Oven

Specifications of F Series Lead-Free Reflow Oven Machine

Reflow soldering technology parameters
SeriesF series Single rail
ModelCY-F820CY-F1020CY-F1220
The heating part parameters
Number of heating zonesUp 8/Down 8 Up 10/ Down 10 Up 12/ Down 12 
Number of cooling zonesTop2/Down 2/Standard   Top3/Down 3/Optional
Heating zone length2900 mm3600 mm4400mm
Transportation part parameters
PCB maximum width Rail type 50-450mm  Mesh belt type 550mm
Transport directionStandard L→R   Optional(R→L)
Guide rail fixed wayFront(Optional:Backend)
Conveyor belt speedMesh belt 875±20mm Chain900±20mm
Transmission wayChain drive + mesh drive
Conveyor belt speed300-2000mm/Min
Control part of the parameter
The power supply 5-wire 3-phase 380V 50/60Hz
Starting power35Kw48Kw68Kw
Normal work consumed powerApprox.7.5KwApprox.8.5KwApprox.10Kw
Heating up time About 15-20 Mins
The temperature control rangeRoom Temperature-300℃
Temperature control mode Fully computerized PID closed-loop control, SSR driver
The whole machine control modePLC/ Computer+ PLC
The temperature control precision±1℃
The deviation of PCB temperature distribution±1-2℃
Cooling wayAir machine: air-cooled
Abnormal alarmAbnormal temperature (ultra-high or ultra-low after constant temperature)


Features of F Series Lead Free Hot Air Reflow Oven

  • Windows 7 operating system, switching between Chinese and English interfaces, easy to operate

  • Equipped with fault diagnosis function, it can display various faults and automatically display and store them in the alarm list

  • The control program can automatically generate and backup various data reports for easy ISO 9000 management

  • CY series reflow soldering focuses on improving the environmental performance of equipment, including a new high-efficiency and energy-saving (air duct structure), greatly reducing energy consumption, and achieving less carbon emissions with lower energy consumption

  • The CY series not only meets the highest requirements for lead-free and soldering, but also ensures high-quality soldering results. Improved heat conduction technology avoids overheating problems of electronic components on PCB boards


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