| Model | SM471 | ||
| Alignment | Flying Vision | ||
| Number of Spindles | 10 Spindles x2 Gantry | ||
| Placement Speed | 75,000 CPH(Optimum) | ||
| Placement Accuracy | Chip | ±50μm@μ+3σ (Based on the Standard Chips) | |
| Component Range | Chip 0402~ 14mm(H 12mm) IC, Connector(Lead Pitch 0.4mm) BGA, CSP(Ball Pitch 0.4mm) | ||
| Board Dimension (mm) | Minimum | 50(L)x 40(W) | |
| Maximum | Single Lane | 510(L)x 460(W) 610(L)x 460(W)(Option) | |
| Dual Lane | 460(L)x250(W) 610(L)x250(W)(Option) | ||
| PCB | Thickness | 0.38~4.2 | |
| Feeder Capacity(Based on 8mm ) | 120ea/112ea(Docking Cart) | ||
| Utility | Power | AC200/208/220/240/380/415V(50/60Hz, 3Phase) Max.5.0kVA | |
| Air Consumption | 0.5~ 0.7MPa(5~ 7kgf/cm:) 350NΩ /min 50N&/min | ||
| Mass | Approx.1,820kg | ||
| External Dimension(mm) | 1,650(L) x 1,690(D) x 1,485(H) | ||
Productivity
On the Fly mounting method
Identifies components without stopping while moving after picking them up
Dramatically reduces travel time between the pick and place position and reduces identification time to zero
Performance
Dual-lane traveling track
Double track production method significantly increases the capacity of small boards and ensures scalability for large boards with a traveling track
Reliability
Monitoring of components before and after mounting
Checking Nozzle contamination during the production process can prevent a large number of components from being missed and components from being thrown away in advance
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Building 2, Xingye 1st Road, Fenghuang Community, Fuyong Street, Bao 'an District, Shenzhen, Guangdong, China. 
